Researchers from the University of Wisconsin-Madison claim to have developed a fast, flexible computer chip on plastic. They have said the thin-film semiconductor technique would help add sensing, computing and imaging capability to an array of materials.
Zhenqiang (Jack) Ma, an electrical and computer engineer along with materials scientist Max Lagally said they developed a process to remove a single crystal film of semiconductor from the substrate on which it is built.
They said this thin layer (only a couple of hundred nanometers thick) could be transferred to glass, plastic or other materials. Traditionally, semiconductors are built on flat, two-dimensional chips upon which a thin film of material is spread.
This film is then etched to make electronic circuits for computers and other electronic devices.