Odisha gets India’s first 3D glass chip packaging plant

The facility set up by US-based 3D Glass Solutions Inc. (3DGS) at Info Valley in Bhubaneswar is worth ₹1,943 crore

Published on: Apr 19, 2026, 16:51:36 IST

By Debabrata Mohanty, Bhubaneswar

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Odisha chief minister Mohan Charan Majhi on Sunday laid the foundation stone for India’s first glass substrate chip packaging unit in Bhubaneswar to boost the country’s semiconductor packaging capabilities.

It is expected to generate over 2,500 direct and indirect jobs. (X/@MohanMOdisha)

The facility set up by US-based 3D Glass Solutions Inc. (3DGS) at Info Valley in Bhubaneswar is worth ₹1,943 crore and will deploy advanced 3D heterogeneous integration (3DHI) packaging technology which India previously relied on imports to access.

Union electronics and IT minister Ashwini Vaishnaw said, “The state is diversifying from metals and minerals to many new industrial bases.”

“A high-tech industry coming to Odisha is a matter of pride. This is an advanced technology. Normally, a silicon substrate is used in chip manufacturing, and now the technology of advanced 3D Glass substrate will be used... We will also work to double the plant’s capacity after the completion of the first phase…” said Vaishnaw.

The vertically integrated unit will package semiconductor chips for high-stakes applications including artificial intelligence, 5G networks, defence systems, data centres, and high-performance computing.

Also Read: Odisha, Singapore sign 8 MoUs in semiconductors, green hydrogen and fintech

The facility will annually produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3D Heterogeneous Integration (3DHI) modules. It is expected to generate over 2,500 direct and indirect jobs.

The technology stack centred on glass interposers and embedded glass substrates represents a shift from conventional organic packaging, offering better thermal performance and higher integration density critical for AI-grade chips.

The 3DGS plant is the second semiconductor facility in Odisha within months. SiCSem Private Limited, in collaboration with UK-based Clas-SiC Wafer Fab Ltd., is already building India’s first commercial silicon carbide (SiC) fabrication unit in the Info Valley campus, targeting an annual output of 60,000 wafers and 96 million packaged units for electric vehicles, railways, defence, and renewable energy.

The Union cabinet approved both Odisha projects in 2025 as part of a broader push that has greenlit 10 semiconductor projects nationwide, with cumulative investments exceeding ₹1.6 lakh crore.

The 3DGS and SiCSem approvals are part of India’s larger ambition to build a self-reliant semiconductor ecosystem and reduce dependence on chip imports.

ABOUT THE AUTHOR
Debabrata Mohanty
Debabrata Mohanty is a senior assistant editor of Hindustan Times who works as state correspondent from Odisha covering the state's politics, governance, public policy, natural disasters, environment and its society for close to three decades. With his long years of reporting from the state capital of Bhubaneswar, Mohanty has been known as one of the most experienced and credible journalists covering Odisha for the national English dailies. His reporting combines on-ground detail with deep institutional knowledge detailing the state's changing politics, governance issues, administrative reforms and the functioning of its public institutions. He has regularly reported on issues ranging from legislative developments and public policy implementation. Politics is his core areas of expertise as he closely tracks Odisha's political landscape, including the rise and transformation of the Bharatiya Janata Party (BJP), the Biju Janata Dal (BJD), the two principal political parties in Odisha. His long association with the state's political establishment enables him to write on contemporary developments in a larger political context. Mohanty takes a deep interest in writing human interest stories, environmental issues and documenting the impact of cyclones, floods, heatwaves, and other climate-related events in one of the most disaster-prone states. His coverage extends to public health, governance reforms and stories on accountability of government institutions. Before joining Hindustan Times, Mohanty worked with The Indian Express, Mail Today, and The Telegraph, where he covered at least six general elections and as many assembly elections. In 2007, he was selected for the prestigious Chevening Young Indian Print Journalist Programme at the University of Lincoln, United Kingdom, where he received advanced training in print journalism. In 2009 he won the Press Institute of India-International Committee of Red Cross award on conflict reporting for his on-ground reportage of 2008 Kandhamal riots.Read More

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